메뉴 바로가기 본문 바로가기
제품 선택

PRODUCT INFO

정면기

비접촉 현상기 (TSG-NCD-200)
제품소개 Package 회로기판에 사용되는 수직현상기로 고해상도와 높은 생산성을 갖추 설비임
제품특징 NON-CONTACT 방식으로 기판 손상 최소화 및 공정 효율 제고

제원

Classification Dry Film Developer Solder Resist Developer
Circuit board type Package Substrate
Size 403 X 508mm~415 X 512mm 
Thickness Min0.035mm(Cu 3/3) - Max 0.5mm
Hole dimension BVH (Min 50㎛) and PTH(Min 50㎛)
Circuit width 15㎛
Diameter 18,500(21,000)(L) X 5,500(W) X 2,600(H)
Process Loader → Buffer → Develop(2 zone) → Post Develop → Buffer → Resine5 Step → Buffer → Air Cut → Hot Dry → Unloader Loader → Buffer → Develop(3 zone) → Post Develop → Buffer → Resine2 Step → Soft Etching → Resine3 Step → Air Cut → Hot Dry → Unloader
Line Speed 1m/min~4m/min(STD 2m/min)
Track Time

Double Type : 45sec (1 PCB : 22.5sec)

Single Type : 35sec (1 PCB : 35sec)

Loader / Unloader 6- axis multi-joint robot
Conveying type Vertical Jig transfer
Production quantity

Double Type : 18,000㎡/month(22hr X 26Day)

Single Type : 12,000㎡/month(22hr X 26Day)

Tray loading capacity -61 pieces
Spray Pressure 1kg/㎠~2.0kg/㎠