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TECHNOLOGY

Equipment Technology

Taesung's challenge is on-going.

Glass Substrate Production Equipment

Enclosed body design

Glass-crack prevention & stable transfer

Anti-static system

Composite Copper Foil Production Equipment

Stable transfer for wide-width / ultra-thin materials

Flexible product specifications

Reliable plating performance

PCB Production Wet Equipment

Magnet-driven drying system

Dual-axis front drive
(supports ultra-thin substrate transfer)

Optimized etching uniformity
(Taesung Triple Etching)

Standard Etching

Vacuum Etching

Two-Fluid Etching

Scrubbing Equipment

Integrated main frame type
(minimizes vibration and noise)

Automatic substrate thickness measurement
*Automatically measures substrate thickness and
adjusts the brush and back-up roll up/down
for consistent surface treatment.