Taesung's challenge is on-going.

Enclosed body design
Glass-crack prevention & stable transfer
Anti-static system
Stable transfer for wide-width / ultra-thin materials
Flexible product specifications
Reliable plating performance
Magnet-driven drying system
Dual-axis front drive
(supports ultra-thin substrate transfer)
Optimized etching uniformity
(Taesung Triple Etching)
Standard Etching
Vacuum Etching
Two-Fluid Etching
Integrated main frame type
(minimizes vibration and noise)
Automatic substrate thickness measurement
*Automatically measures substrate thickness and
adjusts the brush and back-up roll up/down
for consistent surface treatment.