TAESUNG

PRODUCTS

Scrubber

Composite Copper Foil Processing Equipment

Product Feature 1. Transfer of wide / thin board
- W : 1350mm
T : 6.5㎛ (PET or PP 4.5um)
- Minimize product deformation due to horizontal transfer
- Automatic fine adjustment of product tension

2. Plating deviation / Improved currentdensity
- Anode & Cathode Near field (12cm)
- Flow rate range : 200–500 l/min per cell
- Both side movement shield fine tunable
- High current density

3. Plating reliability
- Product full-scale energization method
- Cathode reverse charge prevention

Specification

Composite Copper Foil Processing Equipment SPEC.
PLATING MODULE(5020 mm)	1. Plating Zone \| 1153 = 3345mm 2. Plating Thickness(Condition : Con speed 5 ~ 10 m/min - Dwell Time \| 2.5min - Plating Thickness \| 0.221(Constant)0.244(min)4.04(ASD)0.9(Efficiency)=02.㎛	PLATING LINE (5 MODULE : 25.1M)	1. Plating Thickness (Condition : Con speed 5 ~ 10 m/min) 0.2㎛*5(MODULE) = 1㎛ 2. Capa. \| 36,0000㎡ /mon - Condition \| 10m/min, Max 4 ASD - Working time \| 20hr/day, 30day/omn - Operating rate \| 100%

Composite Copper Foil Processing Equipment SPEC.

PLATING MODULE(5020 mm)

1. Plating Zone | 115*3 = 3345mm

2. Plating Thickness(Condition : Con speed 5 ~ 10 m/min

- Dwell Time | 2.5min

- Plating Thickness |

0.221(Constant)*0.244(min)*4.04(ASD)*0.9(Efficiency)=02.㎛

PLATING LINE (5 MODULE : 25.1M)

1. Plating Thickness

(Condition : Con speed 5 ~ 10 m/min) 0.2㎛*5(MODULE) = 1㎛

2. Capa. | 36,0000㎡ /mon

- Condition | 10m/min, Max 4 ASD

- Working time | 20hr/day, 30day/omn

- Operating rate | 100%