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PRODUCTS

Scrubber

Non-contact type developer
Description A vertical developer with high resolution and high productivity used for package PCB
Product Feature Non-contact type which minimizes the damage on PCB and heightens the process efficiency

Specification

 

ClassificationDry Film DeveloperSolder Resist Developer
Circuit board typePackage Substrate
Size403 X 508mm~415 X 512mm 
ThicknessMin0.035mm(Cu 3/3) - Max 0.5mm
Hole dimensionBVH (Min 50㎛) and PTH(Min 50㎛)
Circuit width15㎛
Diameter18,500(21,000)(L) X 5,500(W) X 2,600(H)
ProcessLoader → Buffer → Develop(2 zone) → Post Develop → Buffer → Resine5 Step → Buffer → Air Cut → Hot Dry → UnloaderLoader → Buffer → Develop(3 zone) → Post Develop → Buffer → Resine2 Step → Soft Etching → Resine3 Step → Air Cut → Hot Dry → Unloader
Line Speed1m/min~4m/min(STD 2m/min)
Track Time

Double Type : 45sec (1 PCB : 22.5sec)

Single Type : 35sec (1 PCB : 35sec)

Loader / Unloader6- axis multi-joint robot
Conveying typeVertical Jig transfer
Production quantity

Double Type : 18,000㎡/month(22hr X 26Day)

Single Type : 12,000㎡/month(22hr X 26Day)

Tray loading capacity-61 pieces
Spray Pressure1kg/㎠~2.0kg/㎠